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ZXTP25012EFH 12V, SOT23, PNP medium power transistor
Summary
BVCEO > -12V hFE > 500 IC(cont) = -4A RCE(sat) = 40m VCE(sat) < -65mV @ 1A PD = 1.25W Complementary part number ZXTN25012EFH
Description
Advanced process capability and package design have been used to maximise the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.
C
B
Features
* * * * High power dissipation SOT23 package High peak current Very high gain, 500 minimum Low saturation voltage
E
E C B Pinout - top view
Applications
* * * * * MOSFET and IGBT gate driving DC - DC converters Motor drive High side driver Line disconnect switch
Ordering information
Device ZXTP25012EFHTA Reel size (inches) 7 Tape width (mm) 8 Quantity per reel 3000
Device marking
1E8 Issue 1 - January 2007
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ZXTP25012EFH
Absolute maximum ratings
Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Continuous collector current(b) Base current Peak pulse current Power dissipation at Tamb =25C(a) Linear derating factor Power dissipation at Tamb =25C(b) Linear derating factor Power dissipation at Tamb =25C(c) Linear derating factor Power dissipation at Tamb =25C(d) Linear derating factor Operating and storage temperature range Tj, Tstg PD PD PD Symbol VCBO VCEO VEBO IC IB ICM PD Limit -12 -12 -7 -4 -1 -10 0.73 5.84 1.05 8.4 1.25 9.6 1.81 14.5 -55 to 150 Unit V V V A A A W mW/C W mW/C W mW/C W mW/C C
Thermal resistance
Parameter Junction to ambient(a) Junction to ambient(b) Junction to ambient(c) Junction to ambient(d) Symbol R JA R JA R JA R JA Limit 171 119 100 69 Unit C/W C/W C/W C/W
NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs
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Characteristics
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Electrical characteristics (at Tamb = 25C unless otherwise stated)
Parameter Collector-base breakdown voltage Symbol BVCBO Min. -12 -12 -7 Typ. -35 -25 -8.5 <-1 -50 -20 IEBO VCE(sat) <-1 -50 -150 -175 -160 Base-emitter saturation voltage VBE(sat) -970 -825 500 300 50 Transition frequency Output capacitance Delay time Rise time Storage time Fall time fT Cobo td tr ts tf 800 450 100 310 16.9 41 62 179 65 MHz pF ns ns ns ns -50 -65 -260 -350 -210 -1050 -950 1500 Max. Unit V V V nA A nA mV mV mV mV mV mV Conditions IC = -100 A IC = -10mA (*) IE = -100 A VCB = -9.6V VCB = -9.6V, Tamb= 100C VEB = -5.6V IC = -1A, IB = -100mA(*) IC = -1A, IB = -10mA(*) IC = -2A, IB = -40mA(*) IC = -4A, IB = -400mA(*) IC = -4A, IB = -400mA(*) IC = -4A, VCE = -2V(*) IC = -10mA, VCE = -2V(*) IC = -1A, VCE = -2V(*) IC = -4A, VCE = -2V(*) IC = -50mA, VCE = -10V f = 100MHz VCB = -10V, f = 1MHz(*) VCC = -10V IC = -1A, IB1 = IB2= -10mA
Collector-emitter breakdown BVCEO voltage (base open) Emitter-base breakdown voltage Collector-base cut-off current Emitter-base cut-off current Collector-emitter saturation voltage BVEBO ICBO
Base-emitter turn-on voltage VBE(on) Static forward current transfer ratio hFE
NOTES: (*) Measured under pulsed conditions. Pulse width
300 s; duty cycle
2%.
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Typical characteristics
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Package outline - SOT23
E
e b 3 leads e1
L1
E1
D
A A1 L c
Dim. A A1 b C D e
Millimeters Min. 0.01 0.30 0.085 2.80 Max. 1.12 0.10 0.50 0.120 3.04 -
Inches Min. 0.0004 0.012 0.003 0.110 Max. 0.044 0.004 0.020 0.008 0.120
Dim. e1 E E1 L L1 -
Millimeters Min. 2.10 1.20 0.25 0.45 Max. 2.64 1.40 0.62 0.62 1.90 NOM
Inches Max. 0.083 0.047 0.018 0.018 Max. 0.104 0.055 0.024 0.024 0.075 NOM
0.95 NOM
0.0375 NOM
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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Intentionally left blank
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Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" Future device intended for production at some point. Samples may be available "Active" Product status recommended for new designs "Last time buy (LTB)" Device will be discontinued and last time buy period and delivery is in effect "Not recommended for new designs" Device is still in production to support existing designs and production "Obsolete" Production has been discontinued Datasheet status key: "Draft version" This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. "Provisional version" This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. "Issue" This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
(c) 2007 Published by Zetex Semiconductors plc
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